Power Hopper / Sunrise

Sunrise / Foreign entity / PFE

Foreign entity / PFE

A prohibited foreign entity is a statutory classification. A Chinese factory, an import, or a Made in USA claim does not decide it.

Cost-percentage safe harbor

This uses the Notice 2025-08 assigned percentages in the way Notice 2026-15 Example 1 describes. Mark lines produced by a prohibited foreign entity, and lines that are not in the project. Every other listed line counts as not prohibited-foreign-entity-produced only if you confirm that. Steel and iron are not in this ratio.

Ground-mount (Tracking) Cells (38.0)
Frame/Backrail (6.0)
Front Glass (6.0)
Encapsulant (3.8)
Backsheet/Backglass (3.8)
Junction Box (1.0)
Edge Seals (0.3)
Pottants (0.3)
Bus Ribbons (1.5)
Bypass Diodes (0.4)
PV module production (4.7)
Printed circuit board assemblies (2.4)
Electrical parts (0.8)
Thermal management system (0.5)
Enclosure and skids (0.6)
Inverter production (1.2)
Torque tube (11.0)
Structural fasteners (0.4)
Drive system (1.9)
Dampers (0.5)
Actuator (2.8)
Controller (0.7)
Rails (2.0)
Tracker production (9.4)
Ground-mount (Tracking) with domestic c-Si cells and wafers Cells (51.6)
Frame/Backrail (4.7)
Front Glass (4.7)
Encapsulant (3.0)
Backsheet/Backglass (3.0)
Junction Box (0.8)
Edge Seals (0.2)
Pottants (0.2)
Bus Ribbons (1.2)
Bypass Diodes (0.3)
PV module production (3.7)
Printed circuit board assemblies (1.7)
Electrical parts (0.6)
Thermal management system (0.4)
Enclosure and skids (0.5)
Inverter production (0.9)
Torque tube (8.6)
Structural fasteners (0.3)
Drive system (1.5)
Dampers (0.4)
Actuator (2.2)
Controller (0.6)
Rails (1.6)
Tracker production (7.3)
Ground-mount (Fixed) Cells (53.2)
Frame/Backrail (8.5)
Front Glass (8.4)
Encapsulant (5.4)
Backsheet/Backglass (5.4)
Junction Box (1.4)
Edge Seals (0.4)
Pottants (0.4)
Bus Ribbons (2.1)
Bypass Diodes (0.6)
PV module production (6.7)
Printed circuit board assemblies (3.1)
Electrical parts (1.1)
Thermal management system (0.7)
Enclosure and skids (0.9)
Inverter production (1.7)
Ground-mount (Fixed) with domestic c-Si cells and wafers Cells (66.6)
Frame/Backrail (6.1)
Front Glass (6.1)
Encapsulant (3.8)
Backsheet/Backglass (3.8)
Junction Box (1.0)
Edge Seals (0.3)
Pottants (0.3)
Bus Ribbons (1.5)
Bypass Diodes (0.4)
PV module production (4.8)
Printed circuit board assemblies (2.2)
Electrical parts (0.8)
Thermal management system (0.5)
Enclosure and skids (0.6)
Inverter production (1.2)
Rooftop (MLPE) Cells (31.1)
Frame/Backrail (4.9)
Front Glass (4.9)
Encapsulant (3.1)
Backsheet/Backglass (3.1)
Junction Box (0.8)
Edge Seals (0.2)
Pottants (0.2)
Bus Ribbons (1.2)
Bypass Diodes (0.3)
PV module production (5.8)
Printed circuit board assemblies (DC-DC) (7.8)
Printed circuit board assemblies (DC-AC) (11.8)
Enclosure (4.3)
Inverter production (0.9)
Structural fasteners (3.5)
Rails (15.0)
Non-steel roof racking production (1.1)
Rooftop (MLPE) with domestic c-Si cells and wafers Cells (43.9)
Frame/Backrail (4.0)
Front Glass (4.0)
Encapsulant (2.5)
Backsheet/Backglass (2.5)
Junction Box (0.6)
Edge Seals (0.2)
Pottants (0.2)
Bus Ribbons (1.0)
Bypass Diodes (0.3)
PV module production (4.7)
Printed circuit board assemblies (DC-DC) (6.4)
Printed circuit board assemblies (DC-AC) (9.5)
Enclosure (3.5)
Inverter production (0.7)
Structural fasteners (2.9)
Rails (12.2)
Non-steel roof racking production (0.9)
Rooftop (String) Cells (38.5)
Frame/Backrail (6.1)
Front Glass (6.1)
Encapsulant (3.9)
Backsheet/Backglass (3.9)
Junction Box (1.0)
Edge Seals (0.3)
Pottants (0.3)
Bus Ribbons (1.5)
Bypass Diodes (0.4)
PV module production (7.2)
Printed circuit board assemblies (DC-DC) (1.6)
Printed circuit board assemblies (DC-AC) (2.4)
Thermal management system (0.5)
Enclosure (1.3)
Inverter production (0.5)
Structural fasteners (4.4)
Rails (18.7)
Non-steel roof racking production (1.4)
Rooftop (String) with domestic c-Si cells and wafers Cells (52.1)
Frame/Backrail (4.8)
Front Glass (4.7)
Encapsulant (3.0)
Backsheet/Backglass (3.0)
Junction Box (0.8)
Edge Seals (0.2)
Pottants (0.2)
Bus Ribbons (1.2)
Bypass Diodes (0.3)
PV module production (5.6)
Printed circuit board assemblies (DC-DC) (1.3)
Printed circuit board assemblies (DC-AC) (1.9)
Thermal management system (0.4)
Enclosure (1.0)
Inverter production (0.4)
Structural fasteners (3.4)
Rails (14.6)
Non-steel roof racking production (1.1)
Grid-scale BESS Cells (52.0)
Packaging (5.6)
Battery pack/module production (8.0)
Printed circuit board assemblies (1.4)
Thermal management system for inverter (0.4)
Electrical parts (0.5)
Enclosure and skids (0.4)
Inverter/converter production (1.9)
Enclosure (14.8)
Battery management system (7.4)
Thermal management system for battery container/housing (5.6)
Battery container/housing production (2.0)
Distributed BESS Cells (26.9)
Packaging (13.4)
Battery pack/module production (2.9)
Printed circuit board assemblies (5.4)
Enclosure and skids (1.0)
Inverter/converter production (4.3)
Enclosure (22.8)
Battery management system (10.1)
Thermal management system for battery container/housing (10.1)
Battery container/housing production (3.1)

Or enter direct costs

Enter one component per line as name, cost, status. Status is PFE, NOT_PFE, or UNKNOWN.


This tool provides research support and is not tax advice.

Power Hopper Sunrise is research support, not tax advice. A product badge is not a project tax credit.